One of the highlights at the interpack 2020 will be the conference entitled “Life without Packaging?”. The conference will address questions such as: What is avoidable? What is necessary? KOCH Pac-Systeme provides an answer to all these issues: “Package the smart way”. For this is the principle under which the special machine manufacturer intelligently brings together all aspects of sustainable packaging: Protection of the environment through recycled or bio-based materials that can be returned to the recycling loop or are biodegradable. Reduced use of materials thanks to innovative processes like the patented Smart Heating system for optimum control of the material thickness. Brand-oriented product presentation with multiple packaging formats: cyclePac® mono-material packaging, blisters made from sustainable film - e.g. RPET - or formable paper. And last but not least: packaging technology that can process conventional blisters as well as eco-friendly packaging. KOCH will be demonstrating just how safe and productive this can be achieved on its KBS-PL blister machine.
Exhibitor Data Sheet