19.05.2020

Robatech GmbH

NEW APPLICATION HEAD FOR TIGHT SPACES

Robatech’s new hot-melt application head SpeedStar Compact delivers the smallest dot and bead application for demanding gluing applications in the packaging, converting, and graphic industry. Smallest installation dimensions, speed, and durability characterize this jetting head.

SpeedStar Compact can be easily integrated into systems with limited space. Thanks to the electronic unit being detached from the jetting head, the SpeedStar Compact is 46 mm shorter than its predecessor SpeedStar Diamond. High-precision adhesive application over the entire service life of 500 million switching cycles is made possible by automatic stroke adjustment, which is unique on the market. With a maximum application speed of 800 dots per second, SpeedStar Compact is particularly suitable for high production speeds.


Exhibitor Data Sheet