Engilico announces a new evolution of the HyperScope® system for seal inspection of plastic or cardboard trays, pots and other thermoformed packages. HyperScope® uses hyperspectral imaging to detect seal contamination with high contrast, even with printed film. The inspection system features GPU-accelerated artificial intelligence, which enables high-precision seal area detection in real-time, regardless of the package orientation, packaging material, layout or size. Another new improvement is the (optionally) integrated conveyor belt that can be completed with an integrated reject unit. Combining these improvements, HyperScope® serves as a fully integrated solution for high-accuracy rigid package inspection.
As Dr. Verbanck, Engilico’s Engineering Director comments: “We are very excited to introduce this new enhanced HyperScope® system. The new design and flexibility of the system enables easy integration into new and existing production lines. In addition, we see that the use of artificial intelligence brings us unprecedented inspection functionality. Engilico® will further use this technology to develop other new exciting capabilities.”
Interested food producers are invited to remotely follow a live, interactive demonstration of the HyperScope® system, inspecting samples of their own products with seal defects. A live video-meeting is consequently organized to see HyperScope® at work.
Contact us to learn more about HyperScope® or to schedule a demonstration
Exhibitor Data Sheet