28.04.2023
Focke Meler Gluing Solutions, S.A.
Meler’s new products await you at Interpack
Meler presents at Interpack the most environmentally friendly melter of the Micron+ range: Micron + foam, a solution that will move businesses forward by optimizing adhesive use and reducing the carbon footprint.
On May 4, one of the most important trade fairs in the packaging sector will start at Messe Düsseldorf, and Meler is getting ready to welcome you at its stand.
Meler’s technical team will conduct live demonstrations to explain in detail the performance of several of their hot melt application solutions. Visitors will be able to check the performance of the most efficient melters range of the market Micron + specially designed to optimize processes in the packaging sector thanks to automation and control tools such as remote connection via bluetooth or instant adhesive monitoring.
MICRON + FOAM, A “MUST-SEE”OF THE NEXT EDITION OF INTERPACK
In addition, Meler arrives at the fair with one of the biggest innovations for the sector: Micron + Foam, the first compact melter for foaming hot melt adhesives launched at the end of 2022. Its great production advantages, 60% energy savings and up to 50% reduction in adhesive consumption, have already positioned it as one of the “must-sees” of the next edition of Interpack.
A VISIT WITH A PRIZE
To thank all packaging specialists for their visit to the stand (Hall: 18 Booth: D26), Meler will hold a contest respecting the legal bases that will allow the winner to obtain a complete adhesive application solution completely FREE.
Your visit to interpack can have a prize!
Give your business the opportunity to optimize its production processes with a brand new adhesive application system.
Stop by Hall: 18 Booth: D26 and schedule an appointment with Meler’s technical team.
Exhibitor Data Sheet
On May 4, one of the most important trade fairs in the packaging sector will start at Messe Düsseldorf, and Meler is getting ready to welcome you at its stand.
Meler’s technical team will conduct live demonstrations to explain in detail the performance of several of their hot melt application solutions. Visitors will be able to check the performance of the most efficient melters range of the market Micron + specially designed to optimize processes in the packaging sector thanks to automation and control tools such as remote connection via bluetooth or instant adhesive monitoring.
MICRON + FOAM, A “MUST-SEE”OF THE NEXT EDITION OF INTERPACK
In addition, Meler arrives at the fair with one of the biggest innovations for the sector: Micron + Foam, the first compact melter for foaming hot melt adhesives launched at the end of 2022. Its great production advantages, 60% energy savings and up to 50% reduction in adhesive consumption, have already positioned it as one of the “must-sees” of the next edition of Interpack.
A VISIT WITH A PRIZE
To thank all packaging specialists for their visit to the stand (Hall: 18 Booth: D26), Meler will hold a contest respecting the legal bases that will allow the winner to obtain a complete adhesive application solution completely FREE.
Your visit to interpack can have a prize!
Give your business the opportunity to optimize its production processes with a brand new adhesive application system.
Stop by Hall: 18 Booth: D26 and schedule an appointment with Meler’s technical team.
Exhibitor Data Sheet