Intelligent Automation for Efficient Packaging Processes: Balluff at Interpack 2026

At Interpack 2026, Balluff will present a comprehensive range of intelligent sensor and automation solutions for the packaging industry. The focus is on improving flexibility, transparency and process reliability across modern packaging and production lines. Visitors will be guided through key application areas, illustrating how intelligent sensing, continuous data acquisition and fast format changeovers can simplify machine design and sustainability, improving equipment performance. 

A particular highlight is Balluff’s Format Change application, which covers both semiautomated and fully automated changeover concepts. The semiautomated approach combines digital position indicators with RFIDbased format identification, enabling fast and repeatable machine adjustments. For fully automated changeovers, Balluff will present a practical application developed in collaboration with Halstrup Walcher. Intelligent drives, combined with Balluff IOLink ClassB Masters, demonstrate how format changes can be fully automated in real production environments. 

Balluff will also showcase its latest innovations in condition monitoring and predictive maintenance. The SAMS platform (Smart Automation and Monitoring System), together with secondgeneration Balluff condition monitoring sensors, continuously records threeaxis vibration frequencies, temperature values and diagnostic data via IOLink. This allows early detection of critical machine conditions, helping to prevent unplanned downtime and significantly increase plant availability. 

In the area of quality assurance, Balluff will present its expanded  Vision offering, including industrial cameras, BVS Automation Ready systems and the RadarImager. This technology enables noncontact inspection in applications where conventional optical solutions reach their limits. 

The exhibition portfolio is further complemented by traceability solutions using RFID and BVS ID for 1D/2D code reading, IO-Link Masters for modular smart IO and control architectures, object detection sensors from the Entry Line, and solutions for industrial connectivity. 

With these innovations and strong partnerships, Balluff underlines its role at Interpack 2026 (Hall 6, Booth A74) as a global technology partner for digital, efficient and futureready packaging processes. 

Exhibitor Data Sheet